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Reflow soldering shall be allowed only 3 times.
Although the check about ultrasonic washing is performed, since it is an dsx321f with a simple substance, the check for the second time by the use state is recommended. Glass Epoxy 1 cycle: Please keep it in the place which direct rays do not hit and dew condensation does not generate. After all products were packaged, must remain more than twenty pieces or mm empty area, which should be sealed by cover-tape. C 10 s s 60 s Total time: Underfilling Material for DSXG Types,KDS considers underfilling material such as heat-cured resin would not affect the dzx321g of the DSXG crystal mounted, however, we recommend the crystal be tested and checked in such a case prior to use so that there are the possibility that the crystal may have a cap off or a crack in the ceramic base.
Apply the following pressure Weight: C and no abnormal appearance shall be observed. Also, no serial bubble is observed by Fluorocarbon tests.
Since mounting by Ultrasonic welding and processing have a possibility of an excessive vibration spreading inside a crystal resonator and becoming the cause of characteristic deterioration and not oscillating, it does not recommend.
DSX321G 25MHz
However please consult in advance about other washing liquid. C 30min 1 cycle dsx321t C and no abnormality shall be observed in external appearance and sealing tightness and others shall be based on ET of EIAJ. A clearance between the soldering terminal portion and a print circuit board side should be less than 0. C Transport Time min ?
The tip of cover-tape dks be fixed temporary by paper tape and roll around the core of reel one round. C perform the attached Reflow conditions to reference. Avoid using the product at temperature higher than specified. Be sure to have a mounting test in advance by using the actual mounting machine and check that the characteristics of the products are not damaged kda the automatic mounting. Please refrain from forming patterns between crystal land pattern’s since there is a possibility to cause crack in base.
Further,parts shall be solderd on substrate, fixed Aluminum materials about g. The empty embossed area which are sealed by cover-tape must remain more than 40mm.
DSXG 32MHz from KDS Daishinku
Mount the specimen on substrate. In the process where the boad is warped, such as board separation process, be dsxx321g that the warping does not influence the characteristics and soldering of crystal products. C 3cycles 18times drop from cm heights to concrete.
Sine waves of 1. It is a guaranteed term because it obtains an excellent soldering: However when too much shock is added according to a certain cause, the use after a characteristic check is recommended. C and no abnormality shall be observed in external appearance and sealing tightnen and others shall be based on ET of EIAJ.
DSX321G 32MHz
M Plating material of a terminal. In the upper and lower part and the opening ddx321g box it shall be protected products using aircushion sheets. Please use it below with the value specified on a catalog and specifications.