Find the most up-to-date version of JEDEC JESD at Engineering Environmental Acceptance. Requirements for Tin Whisker. Susceptibility of Tin and Tin Alloy. Surface Finishes. JESD MARCH JEDEC SOLID STATE . JEDEC standard JESD22A, Measuring Whisker Growth on Tin and Tin Alloy The JEDEC standard JESD , Environmental Acceptance.
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This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.
Current jesr Search found 9 items.
Registration or login required. Registration or login required. The predominant terminal finishes on electronic components have been Sn-Pb alloys. External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component.
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Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included.
The potential effectiveness of various mitigation practices will also be briefly discussed. This methodology may not be sufficient for applications with special requirements, i. This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions.
This methodology may not be sufficient for applications with special requirements, i. Search by Keyword or Document Number. Multiple Chip Packages JC This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation.
Most of the content on this site remains free to jexd with registration. Quality and Reliability of Solid State Products filter. Additional requirements may be specified in the appropriate requirements procurement documentation.
Multiple Chip Packages JC It does not define the quality and reliability requirements that the component must satisfy. Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included.
The methodology described in this document is applicable for environmental acceptance testing of tin jesc surface finishes and mitigation practices for tin whiskers. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: Search by Keyword or Document Number. Displaying 1 – 9 of 9 documents. Solid State Memories JC The user should evaluate and choose the best jewd to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects.
Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.
JESD Tin Whisker Test Results
This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.
It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. Current search Search jrsd 2 items.
This reference for technical writers and educators, manufacturers, and buyers and users of jess solid state devices is now available. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. Additional requirements may be specified in the appropriate requirements procurement documentation. Show 5 results per page.
Terms, Definitions, and Symbols filter JC The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry.
References behind each of the theories and mitigation practices are provided. This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. Filter by document type: This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.
The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry.